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Applied Microengineering Ltd.

Didcot,  Oxfordshire 
United Kingdom
http://www.aml.co.uk
  • Booth: 6142

AML - Wafer Bonders with optical, in-situ wafer alignment

Overview

AML, established in 1992, designs and manufactures Wafer Bonding systems with integrated in-situ alignment capabilities.

Click to download our brochure!

The AWB systems enable a wide range of bonding techniques to be carried out and are ideally-suited to process development.  With a worldwide customer base, AWB systems are used for both R&D and commercial production of devices for wafer sizes up to 8”.

The systems feature an integral, optical wafer-to-wafer alignment system as standard, with the capability of 1µm accuracy.  All bonding process steps can be carried out sequentially within the bonding chamber, so without exposure to air between stages:

  • Wafers are held in separation, up to 30mm apart
  • operation under vacuum or controlled atmosphere
  • independent heating of upper/lower wafers, up to 560°C
  • in-situ radical-activation or chemical treatment of bonding surfaces
  • in-situ alignment, immediately prior to bonding
  • bonding, with contact forces up to 40kN

The systems offer auto-aligning and bonding via user-programmed recipes.


  Products

  • ROCK Aligner-Bonder System
    The ROCK system offers the flexibility and capabilities for a wide range of bonding techniques, and features an optical wafer-to-wafer alignment system, providing 1um accuracy. A fully-integrated cryopump offers UHV vacuum levels in the 10-8mbar range....

  • Applied Microengineering Ltd (AML) design and manufacture wafer-bonding systems with integrated wafer-to-wafer alignment capabilities; the ROCK systems, with integral cryopump, offer UHV vacuum levels in the 10-8mbar range.

    The ROCK-04 system is designed for bonding 3”, 4” and 6” wafer sizes, and the ROCK-08 system for larger 6” and 8” wafers.

    The systems offer the capabilities for a wide range of bonding techniques, including anodic, direct, eutectic, thermocompression, adhesive etc.  All process steps - surface treatment, wafer-wafer alignment and bonding - can be carried out sequentially within the same chamber without any further exposure to air.

    Align and bond in one system!  As with the AWB system, the ROCK offers flexibility and important advantages when developing advanced bonding processes, and the in-situ alignment facility avoids the need for two separate systems – reducing cost and simplifying operation, and minimising cleanroom space requirements.

  • AWB Aligner-Bonder System
    The AWB system offers the capabilities for a wide range of bonding techniques, and features an integral, optical wafer-to-wafer alignment system, providing 1um accuracy....

  • Applied Microengineering Ltd (AML) design and manufacture wafer-bonding systems with integrated wafer-to-wafer alignment capabilities; the AWB-04 system is designed for bonding 3”, 4” and 6” wafer sizes and the AWB-08 system for larger 6” and 8” wafers.

    The AWB systems offer the capabilities for a wide range of bonding techniques including anodic, direct, eutectic, thermocompression, adhesive etc., and feature an integral, optical wafer-to-wafer alignment system as standard, with +/- 1µm accuracy.

    Following (manual) loading of the wafers into the chamber, all process steps can be carried out sequentially without any further exposure to air:  treatment of the wafer surfaces, wafer alignment and bonding.

    Align and bond in one system!  The AWB system offers flexibility and important advantages when developing processes, and avoids the need for two separate systems – reducing cost and simplifying operation, and minimising the cleanroom space requirements.


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